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Cree® UltraThin® Gen 3 LEDs
Data Sheet CxxxUT170-Sxxxx-31
Cree’s UltraThin® LEDs combine highly efficient InGaN materials with Cree’s proprietary G•SiC® substrate to deliver superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low forward voltage. Cree’s UT™ series chips are tested for conformity to optical and electrical specifications, as well as the ability to withstand 2000 V ESD. Applications include consumer products, mobile devices and automotive applications where a small, thin form factor is required.
FEATURES
• Small Chip – 170 x 170 x 50 μm • Single Wire Bond Structure • UT LED Performance
– 450 nm – 12+ mW – 460 nm – 10+ mW – 470 nm – 10+ mW – 527 nm – 4+ mW • Low Forward Voltage – 2.