XGZP161
FEATURES
- Range: -100～0…500k Pa G…1500k Pa G
- MEMS technology, Solid-state reliability
- Si-glass bonding die, High pressure range
- Surface mounting or Through hole soldering
- For non-corrosive gas or air
- Working temp.: -30℃～+125℃(-22℉～+257℉)
- Gage pressure type(Positive&Negative Pressure)
- Easy to use and embed in OEM equipment
APPLICATIONS
- For medical and healthy equipment, e.g. Patient Monitoring, Infusion and Syringe Pumps, Anesthesia machines, Respirators and Ventilators, NPWT, DVT, Catheter, COPD Treatment, Kidney dialysis, Cupping& Cosmetology, Hospital beds, Massage device etc.
- For white goods and consumer electronics, e.g. Refrigerator, Printer, Humidifier, Washer/Dryer, Coffee machine, Dust collector or Cleaner, Robotic ,Sport equipment etc.
- For more fields, e.g. Digital display meter, Air pump, Process control, Pressure switching, HVAC and pneumatic device, Air flow monitor, Automation, Automotive electronic etc.
INTRODUCTION
XGZP161 is a surface mounting pressure...
