SOT23-5 - surface mount

Bourns

Datasheet Details

Part number	SOT23-5
Manufacturer	Bourns
File Size	146.43 KB
Description	surface mount
Datasheet	SOT23-5 Datasheet

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PACKAGE MECHANICAL INFORMATION SOT23-5 Package Outline Dimensions This surface mount package consists of a chip mounted on a leadframe and fully encapsulated in an epoxy mold compound. With Pb-Free terminations, this package meets the requirements of IPC/Jedec J-STD-20, moisture level 1 at 260 °C. 5-Pin Plastic Small Outline Surface Mount MO-178, AA, JEDEC 95 1.90 TYP. (0.075) 2.60 - 3.00 (0.102 - 0.118) 5 4 1 2 3 1.14 - 1.35 (0.045 - 0.053) 0.95 TYP. (0.037) 2.80 - 3.00 (0.110 - 0.118) 1.50 - 1.70 (0.059 - 0.067) 8 ° MAX. 0.00 - 0.15 (0.000 - 0.006) DIMENSIONS ARE : MILLIMETERS (INCHES) 0.30 - 0.50 (0.012 - 0.020) 0.30 - 0.50 (0.012 - 0.020) JUNE 2008 WARNING Cancer and Reproductive Harm www.P65Warnings.ca.gov Speciﬁcations are subject to change without notice.