FFM201G
Features
- Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
- Low profile surface mounted application in order to optimize board space.
- High current capability.
- Fast switching for high efficiency.
- High surge current capability.
- Glass passivated chip junction.
- Lead- free parts meet Ro HS requirments.
- Suffix "-H" indicates Halogen-free parts, ex. FFM201-MG-H.
Mechanical data
- Epoxy: UL94-V0 rated frame retardant
- Case: Molded plastic, JEDEC DO-214AC / SMA
- Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
- Polarity: lndicated by cathode band
- Mounting Position: Any
- Weight: Approximated 0.05 gram
FFM201G THRU FFM207G
Package outline SMA
0.196(4.9) 0.180(4.5)
0.012(0.3) Typ.
0.106(2.7) 0.091(2.3)
0.032(0.8) Typ.
0.068(1.7) 0.060(1.5)
0.032 (0.8) Typ.
Dimensions in inches and (millimeters)
Maximum ratings (AT TA=25o C unless otherwise noted)
PARAMETER Forward rectified current
See...
