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HSMS-286E - Surface Mount Microwave Schottky Detector Diodes

Download the HSMS-286E datasheet PDF (HSMS-2860 included). The manufacturer datasheet provides complete specifications, pinout details, electrical characteristics, and typical applications for surface mount microwave schottky detector diodes.

Description

Avago’s HSMS‑286x family of DC biased detector diodes have been designed and optim­ized for use from 915 MHz to 5.8 GHz.They are ideal for RF/ID and RFTag applications as well as large signal detection, modulation, RF to DC conversion or voltage doubling.

Features

  • Surface Mount SOT-23/SOT‑143 Packages.
  • Miniature SOT-323 and SOT‑363 Packages.
  • High Detection Sensitivity:   up to 50 mV/µW at 915 MHz   up to 35 mV/µW at 2.45 GHz   up to 25 mV/µW at 5.80 GHz.
  • Low FIT (Failure in Time) Rate.
  • Tape and Reel Options Available.
  • Unique Configurations in Surface Mount SOT-363 Package.
  • increase flexibility.
  • save board space.
  • reduce cost.
  • HSMS-286K Grounded Center Lea.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (HSMS-2860-AVAGO.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number HSMS-286E
Manufacturer AVAGO
File Size 304.14 KB
Description Surface Mount Microwave Schottky Detector Diodes
Datasheet download datasheet HSMS-286E Datasheet
Other Datasheets by AVAGO

Full PDF Text Transcription

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HSMS-286x Series Surface Mount Microwave Schottky Detector Diodes Data Sheet Description Avago’s HSMS‑286x family of DC biased detector diodes have been designed and optim­ized for use from 915 MHz to 5.8 GHz.They are ideal for RF/ID and RFTag applications as well as large signal detection, modulation, RF to DC conversion or voltage doubling. Available in various package ­conf­igurations, this family of detector diodes provides low cost solutions to a wide variety of design problems. Avago’s manufacturing techniques assure that when two or more diodes are mounted into a single surface mount package, they are taken from adjacent sites on the wafer, assuring the highest possible degree of match. Pin Connections and Package Marking 16 25 34 Notes: 1.
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