DFR1G-Q1
Features
Glass passivated device Ideal for surface mouted applications Low reverse leakage
Metallurgically bonded construction
High temperature soldering guaranteed: 250 C/10 seconds,0.375”(9.5mm) lead length, 5 lbs. (2.3kg) tension pliant to Ro HS Directive 2011/65/EU pliant to Halogen-free Suffix "-Q1" for AEC-Q101
1.8± 0.2
Package outline
SOD-123
Cathode Band Top View
0.2
0.10-0.30
1.1± 0.25
Mechanical data
Case : JEDEC SOD-123 molded plastic body over passivated chip
Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end Mounting Position: Any
0.60.25
3.70.2 Dimensions in millimeters
Maximum ratings and Electrical Characteristics (AT TA=25o C unless otherwise noted)
PARAMETER
CONDITIONS
Symbol MIN. TYP. MAX.
Forward rectified current
See Fig.2
UNIT A
Forward surge current
8.3ms single half sine-wave (JEDEC methode)
IFSM
Reverse current
Thermal resistance Diode junction capacitance Storage...
