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Advance v0.1
Radiation-Tolerant ProASIC3 Low-Power SpaceFlight Flash FPGAs
with Flash*Freeze Technology Features and Benefits
MIL-STD-883 Class B Qualified Packaging
• Ceramic Column Grid Array with Six Sigma CopperWrapped Lead-Tin Columns • Land Grid Array • High-Performance, Low-Skew Global Network • Architecture Supports Ultra-High Utilization
®
Advanced and Pro (Professional) I/Os
• 700 Mbps DDR, LVDS-Capable I/Os • 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation • Bank-Selectable I/O Voltages—up to 8 Banks per Chip • Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V / 2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X, and LVCMOS 2.5 V / 5.