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3M Chip Carrier Socket
4-Row, Thru-hole
PLCCE Series
S Low profile .200″ maximum height S Designed for automatic assembly S High temperature insulator compatible with
IR reflow and wave soldering S Open frame allows visual inspection of solder
joints
Date Modified:March 10, 2003
Physical
Insulation Material: Glass Filled PPS
Flammability: UL 94V-0 Color: Black, Brown
Contact Material: Phosphor Bronze
Plating Underplating: 50 µ″, [ 1.3 µm ] Nickel Wiping Area: 100 µ″, [ 2.5 µm ] Tin/Lead Solder Tail Area: 200 µ″, [ 5.1 µm ] Tin/Lead
Electrical
Contact Resistance: 20 mΩ Insulation Resistance: 103 MΩ min. at 500 VDC
Capacitance: 1 pF
Environmental
Temperature Rating: --55°C to +105°C
TS-1156-01 Sheet 1 of 3
UL File No.: E68080
3
Interconnect Solutions http://www.3M.