Description
The device is designed to protect high-speed interfaces such as SuperSpeed and Hi-Speed USB combination, SD-memory card 3.0 and thunderbolt interfaces against ElectroStatic Discharge (ESD).
The device includes six high-level ESD protection diode structures for ultra high-speed signal lines.
Features
- System-level ESD protection for USB 2.0 and USB 3.2 combination, SD-memory card and thunderbolt interfaces.
- Supports SuperSpeed USB 3.2 at 10 Gbps.
- All signal lines with integrated rail-to-rail clamping diodes for downstream ESD protection of ±15
kV exceeding IEC 61000-4-2, level 4.
- Matched 0.5 mm trace spacing.
- Line capacitance of only 0.35 pF for each channel.
- Design-friendly ‘pass-through’ signal routing
3.