Datasheet4U Logo Datasheet4U.com

BC807-16QCH-Q - 500mA PNP general-purpose transistors

Description

PNP general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless SurfaceMounted Device (SMD) plastic package with side-wettable flanks.

Table 1.

Features

  • High power dissipation capability.
  • High current.
  • Three current gain selections.
  • Suitable for Automatic Optical Inspection (AOI) of solder joint.
  • Smaller footprint compared to conventional leaded SMD packages.
  • Low package height of 0.5 mm.
  • High-temperature.

📥 Download Datasheet

Datasheet Details

Part number BC807-16QCH-Q
Manufacturer Nexperia
File Size 313.13 KB
Description 500mA PNP general-purpose transistors
Datasheet download datasheet BC807-16QCH-Q Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
BC807-16 PNP Transistor NXP
BC807-16 45V PNP SMALL SIGNAL TRANSISTOR DIODES
BC807-16 PNP Plastic-Encasulate Transistor Taiwan Semiconductor
BC807-16 PNP SILICON TRANSISTOR UTC
BC807-16 PNP Silicon AF Transistor Infineon

Other Datasheets by Nexperia

Part Number Description
BC807-16QC-Q 500mA PNP general-purpose transistors
BC807-16 500mA PNP general-purpose transistors
BC807-16H 500mA PNP general-purpose transistors
BC807-16L 500mA PNP general-purpose transistors
BC807-16LW 500mA PNP general-purpose transistors

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
BC807QCH-Q series 45 V, 500 mA PNP general-purpose transistors Rev. 1 — 25 January 2022 Product data sheet 1. General description PNP general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless SurfaceMounted Device (SMD) plastic package with side-wettable flanks. Table 1. Product overview Type number Package Name BC807-16QCH-Q DFN1412D-3 BC807-25QCH-Q BC807-40QCH-Q JEDEC MO-340CA Version SOT8009 NPN complement BC817-16QCH-Q BC817-25QCH-Q BC817-40QCH-Q 2. Features and benefits • High power dissipation capability • High current • Three current gain selections • Suitable for Automatic Optical Inspection (AOI) of solder joint • Smaller footprint compared to conventional leaded SMD packages • Low package height of 0.
Published: |