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PROCESS
12 Volt TVS Chip
CPZ37R
Transient Voltage Suppressor
PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization 6.7 x 6.7 MILS 3.54 MILS 4.3 x 4.3 MILS Al - 13,000Å Au-As/Ag - 13,000Å/6,000Å
GEOMETRY GROSS DIE PER 5 INCH WAFER 368,512 PRINCIPAL DEVICE TYPE CTLTVS12
R0 (16-March 2012)
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CPZ37R Datasheet
