IC37 - Dual Inline Package

Datasheet Details

í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type Outline Socket Dimensions Recommended PC Board Layout Top View from Socket 2.4 A B±0.05 0.36 -0.1 +0.2 B±0.1 1.8 3.2 H J±0.2 J±0.1 2.54±0.05 (Contact pos. ) D±0.2 +0.2 C -0.3 E +0.3 0 G F 2.54±0.1 14.5 2- Æ3.2 1.5 4.0 G±0.1 2- Æ3.2 0.5 3.5.

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Published: Feb 24, 2011 |