Description
PMPAK® 3x3
P-CH
XP3700 series are innovated design and silicon process technology to achieve the lowest possible on-resistance and fast switching performance.It provides the designer with an extreme efficient device for use in a wide range of power applications.BVDSS RDS(ON) ID3 BVDSS RDS(ON) ID3
D1
30V 20mΩ 8.7A -30V 45mΩ -6.1A
D2
The PMPAK ® 3x3 package is special for voltage conversion G1
G2
application using standard infrared reflow technique with the backside heat sink to achieve
XP3700YT Datasheet
