236 - Board Level Power Semiconductor Heat Sinks

Datasheet Details

Part number	236
Manufacturer	Wakefield Thermal Solutions
File Size	261.37 KB
Description	Board Level Power Semiconductor Heat Sinks
Datasheet	236_WakefieldThermalSolutions.pdf

for TO-220 semiconductors. Their unique design (patent pending) ensures uniform force applied to the component for effective and maximum thermal contact in horizontal or vertical mounting positions while eliminating the need for fastening hardware. A mounting hole is available for hardware mounting when desired. The 230 and 234 Series can be used interchangeably. The 234 Series has standoffs on the base of the heat sink. Specify solderable tab options by the addition of suffix 01, 05, or 10 to t.

📁 236 Similar Datasheet

Other Datasheets by Wakefield Thermal Solutions

Published: Apr 6, 2005 |