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FESF8BT - Ultrafast Plastic Rectifier

Download the FESF8BT datasheet PDF. This datasheet also covers the FES8AT variant, as both devices belong to the same ultrafast plastic rectifier family and are provided as variant models within a single manufacturer datasheet.

Features

  • Power pack.
  • Glass passivated pellet chip junction.
  • Ultrafast recovery time.
  • Low switching losses, high efficiency.
  • Low leakage current.
  • High forward surge capability.
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package).
  • Solder dip 275 °C max. , 10 s per JESD 22-B106 (for TO-220AC and ITO-220AC package).
  • AEC-Q101 qualified.
  • Material categorization: for definitions of compliance.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (FES8AT-Vishay.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number FESF8BT
Manufacturer Vishay
File Size 138.48 KB
Description Ultrafast Plastic Rectifier
Datasheet download datasheet FESF8BT Datasheet

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FESF8AT FAST EFFICIENT PLASTIC RECTIFIER General Semiconductor
FESF8AT 8A Isolational Super Fast Glass Passivated Rectifier SENSITRON SEMICONDUCTOR

Other Datasheets by Vishay

Part Number Description
FESF8AT Ultrafast Plastic Rectifier
FESF8CT Ultrafast Plastic Rectifier
FESF8DT Ultrafast Plastic Rectifier
FESF8FT Ultrafast Plastic Rectifier
FESF8GT Ultrafast Plastic Rectifier

Full PDF Text Transcription

Click to expand full text
www.vishay.com FES8xT, FESF8xT, FESB8xT Vishay General Semiconductor Ultrafast Plastic Rectifier TO-220AC ITO-220AC FES8xT PIN 1 PIN 2 2 1 CASE TO-263AB K FESF8xT PIN 1 PIN 2 2 1 2 1 FESB8xT PIN 1 PIN 2 K HEATSINK PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM trr VF TJ max. Package 8.0 A 50 V to 600 V 125 A 35 ns, 50 ns 0.95 V, 1.30 V, 1.50 V 150 °C TO-220AC, ITO-220AC, TO-263AB Diode variations Single die FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max.
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