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FESB8DT - Ultrafast Plastic Rectifier

Download the FESB8DT datasheet PDF (FES8AT included). The manufacturer datasheet provides complete specifications, pinout details, electrical characteristics, and typical applications for ultrafast plastic rectifier.

Features

  • Power pack.
  • Glass passivated pellet chip junction.
  • Ultrafast recovery time.
  • Low switching losses, high efficiency.
  • Low leakage current.
  • High forward surge capability.
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package).
  • Solder dip 275 °C max. , 10 s per JESD 22-B106 (for TO-220AC and ITO-220AC package).
  • AEC-Q101 qualified.
  • Material categorization: for definitions of compliance.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (FES8AT-Vishay.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number FESB8DT
Manufacturer Vishay
File Size 138.48 KB
Description Ultrafast Plastic Rectifier
Datasheet download datasheet FESB8DT Datasheet

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Full PDF Text Transcription

Click to expand full text
www.vishay.com FES8xT, FESF8xT, FESB8xT Vishay General Semiconductor Ultrafast Plastic Rectifier TO-220AC ITO-220AC FES8xT PIN 1 PIN 2 2 1 CASE TO-263AB K FESF8xT PIN 1 PIN 2 2 1 2 1 FESB8xT PIN 1 PIN 2 K HEATSINK PRIMARY CHARACTERISTICS IF(AV) VRRM IFSM trr VF TJ max. Package 8.0 A 50 V to 600 V 125 A 35 ns, 50 ns 0.95 V, 1.30 V, 1.50 V 150 °C TO-220AC, ITO-220AC, TO-263AB Diode variations Single die FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low leakage current • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max.
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