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BYWB29-200 - Ultrafast Rectifier

Download the BYWB29-200 datasheet PDF. This datasheet also covers the BYW29-50 variant, as both devices belong to the same ultrafast rectifier family and are provided as variant models within a single manufacturer datasheet.

Features

  • Power pack.
  • Glass passivated pellet chip junction.
  • Ultrafast recovery time.
  • Low switching losses, high efficiency.
  • Low forward voltage drop.
  • High forward surge capability.
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package).
  • Solder dip 275 °C max. 10 s, per JESD 22-B106 (for TO-220AC and ITO-220AC package).
  • AEC-Q101 qualified.
  • Material categorization: for definitions of compl.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (BYW29-50-Vishay.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number BYWB29-200
Manufacturer Vishay
File Size 131.42 KB
Description Ultrafast Rectifier
Datasheet download datasheet BYWB29-200 Datasheet

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BYWB29-50 FAST EFFICIENT PLASTIC RECTIFIER General Semiconductor
BYW100-200 HIGH EFFICIENCY FAST RECOVERY RECTIFIER DIODE STMicroelectronics

Other Datasheets by Vishay

Part Number Description
BYWB29-100 Ultrafast Rectifier
BYWB29-150 Ultrafast Rectifier
BYWB29-50 Ultrafast Rectifier
BYW27-100GP Glass Passivated Junction Rectifier
BYW27-200GP Glass Passivated Junction Rectifier

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.vishay.com BYW29-xxx, BYWF29-xxx, BYWB29-xxx Vishay General Semiconductor Ultrafast Rectifier TO-220AC ITO-220AC BYW29 Series PIN 1 PIN 2 CASE 2 1 TO-263AB K 1 BYWF29 Series PIN 1 2 PIN 2 2 1 BYWB29 Series PIN 1 K PIN 2 HEATSINK FEATURES • Power pack • Glass passivated pellet chip junction • Ultrafast recovery time • Low switching losses, high efficiency • Low forward voltage drop • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 275 °C max. 10 s, per JESD 22-B106 (for TO-220AC and ITO-220AC package) • AEC-Q101 qualified • Material categorization: for definitions of compliance please see www.vishay.
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