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FCSP130TR - Chip Scale Package Schottky Barrier Rectifier

FCSP130TR Description

FCSP130TR Vishay High Power Products FlipKY®, 1.0 A .
True chip-scale packaging is available from Vishay HPP.

FCSP130TR Features

* Ultra low VF per footprint area
* Low thermal resistance
* One-fifth footprint of SMA
* Super low profile (< 0.7 mm)
* Available tested on tape and reel
* Small footprint, surface mountable FlipKY® RoHS COMPLIANT
* Low forward voltage drop

FCSP130TR Applications

* requiring low forward drop and very small footprints on PC boards. Typical applications are in disk drives, switching power supplies, converters, freewheeling diodes, battery charging, and reverse battery protection. The FlipKY® package, is one-fifth the footprint of a comparable SMA package and has

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Chip Scale Package Schottky Barrier Rectifier Vishay Siliconix
Vishay Siliconix FCSP130TR-like datasheet

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