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MD59-0021RTR - PCS CDMA LNA / Downconverter 1.8-2.0 GHz

Description

M/A-COM’s MD59-0021 is a fully integrated downconverter IC with LNA, RF amplifier, downconverting mixer, IF amplifier and LO buffer amplifier in a miniature TSSOP-16 plastic package with exposed metal lead frame backside for improved high frequency grounding.

Features

  • High Integrated LNA and Downconverter Operates over 2.7 V to 5V Supply Voltage Low Noise Figure < 2.7 dB High Input Intercept Point -12 dBm Optional Control of LNA IP3 Low LO Drive Level -10 dBm Operates in US and Korean PCS Bands Miniature TSSOP-16 Plastic Package TSSOP-16 Plastic Package1 (.039) (1) Pin 16 .041/.031 1,05/,80 .252 6,4 .177/.169 4,5/4,3 Pin 1 .0256 0,65 .201/.193 5,1/4,9 Exposed Pad .118 3,0 De.

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Other Datasheets by Tyco Electronics (now TE Connectivity)

Part Number Description
MD59-0021 PCS CDMA LNA / Downconverter 1.8-2.0 GHz
MD59-0021SMB PCS CDMA LNA / Downconverter 1.8-2.0 GHz
MD59-0021TR PCS CDMA LNA / Downconverter 1.8-2.0 GHz
MD59-0022 PCS CDMA Upconverter / Driver 1710 1710.1910 MHz
MD59-0022RTR PCS CDMA Upconverter / Driver 1710 1710.1910 MHz

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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MD59-0021 PCS CDMA LNA / Downconverter 1.8— 1.8 — 2.0 GHz Features • • • • • • • • High Integrated LNA and Downconverter Operates over 2.7 V to 5V Supply Voltage Low Noise Figure < 2.7 dB High Input Intercept Point -12 dBm Optional Control of LNA IP3 Low LO Drive Level -10 dBm Operates in US and Korean PCS Bands Miniature TSSOP-16 Plastic Package TSSOP-16 Plastic Package1 (.039) (1) Pin 16 .041/.031 1,05/,80 .252 6,4 .177/.169 4,5/4,3 Pin 1 .0256 0,65 .201/.193 5,1/4,9 Exposed Pad .118 3,0 Description M/A-COM’s MD59-0021 is a fully integrated downconverter IC with LNA, RF amplifier, downconverting mixer, IF amplifier and LO buffer amplifier in a miniature TSSOP-16 plastic package with exposed metal lead frame backside for improved high frequency grounding.
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