MA4BPS301 - PIN Diode Chips with Offset Bond Pads

Product Overview

Tyco

Part number	MA4BPS301
Manufacturer	Tyco
File Size	83.95 KB
Description	PIN Diode Chips with Offset Bond Pads
Datasheet	MA4BPS301 Datasheet
Additional preview pages of the MA4BPS301 datasheet.

These silicon - glass PIN diode chips are fabricated with M/A-COM’s patented HMIC™ process.

Bond Pads Removed From Active Junction Large Bond Pads Support Multiple Bond Wires Rugged Silicon-Glass Construction Silicon Nitride Passivation Polyimide Scratch Protection Chip Layout.

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Published: Apr 27, 2005 |