Description
Multiple manufacture source
Multiple manufacture source
Green compound
Define manufacture source
Green compound
Document Number: DS_S1412006
Version: F14
Small Signal Product
PACKAGE OUTLINE DIMENSIONS
SUGGEST PAD LAYOUT
PIN CONFIGURATION
BAS40 / -04 / -05 / -06
Taiwan Semiconductor
DIM.A B C D E F G H
Unit(mm)
Min Max 2.70 3.10 1.10 1.50 0.30 0.51 1.78 2.04 2.10 2.64 0.89 1.30
0.55 REF 0.10 REF
Unit(inch)
Min Max
0.106 0.122
0.043 0.059
0.012 0.020
0.070 0.083
0.080 0.104
0.035 0
Features
- - Metal-on-silicon schottky barrier - Surface device type mounting - Moisture sensitivity level 1 - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Packing code with suffix "G" means
green compound (halogen-free).