Description
Bump Side View
TSM4405P is new low cost, state of the art MicroSURFTM lateral MOSFET process technology in chip scale bondwireless packaging minimizes PCB space and Rds(on) plus provides an ultra low Qg x Rds(on) figure of merit.
Features
- Low profile package: less than 0.8mm height when mounted on PCB Occupies only 1.21mm of PCB area
2
Less than 30% of the area of a SC-70 Excellent thermal and electrical capabilities Lead free solder bumps available
Block Diagram
Ordering Information
Part No. TSM4405P Packing Tape & Reel Q’ty 3kpcs / 7”
Absolute Maximum Rating (Ta = 25 oC unless otherwise noted)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current Maximum Power Dissipation (Steady S.
TSM4405P_TaiwanSemiconductorCompany.pdf
