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CP201209T-152x - Multilayer Chip Beads

Download the CP201209T-152x datasheet PDF (CP201209 included). The manufacturer datasheet provides complete specifications, pinout details, electrical characteristics, and typical applications for multilayer chip beads.

Features

  • 1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk. 2.Extremely high reliability due to entirely monolithic construction. 3.Low DC resistance structure of electrode to prevent wasteful electric power consumption. 4.Hing Current rating up to 6A. 5.The products contain no lead and also support lead-free soldering.

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Note: The manufacturer provides a single datasheet file (CP201209_TaeJin.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number CP201209T-152x
Manufacturer TaeJin
File Size 1.29 MB
Description Multilayer Chip Beads
Datasheet download datasheet CP201209T-152x Datasheet

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Full PDF Text Transcription

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Multilayer Chip Beads / CP TYPE（Large Current） .Features: 1.Closed magnetic circuit structure allows high density mounting while preventing crosstalk. 2.Extremely high reliability due to entirely monolithic construction. 3.Low DC resistance structure of electrode to prevent wasteful electric power consumption. 4.Hing Current rating up to 6A. 5.The products contain no lead and also support lead-free soldering. .Applications: CP type has a large current funtion for power line due to its low DC resistance, it can generate an impedance down to relative low frequency and cover a wide range of noise suppression. .Product Identification： PIHD □□□□ □ □□□ □ Tolerance Inductance .Shape and Dimension .Schematic Dimensions in mm TYPE CP160808 CP201209 CP321611 CP451616 CP453215 A(mm) 1.6±0.2 2.0±0.
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