Datasheet4U.com

MMZ2012Y601B - (MMZ Series) CHIP BEADFERRITE

Product Overview

TDK

📥 Download Datasheet

MMZ2012Y601B (MMZ Series) CHIP BEADFERRITE by TDK - Datasheet Preview — Datasheet preview – MMZ2012Y601B

Datasheet Details

Part number	MMZ2012Y601B
Manufacturer	TDK
File Size	106.00 KB
Description	(MMZ Series) CHIP BEADFERRITE
Datasheet	MMZ2012Y601B Datasheet
Additional preview pages of the MMZ2012Y601B datasheet.

Product details

Features

Chip bead(impeder), MMZ series offers 4 construction materials.
Size standardized for use by automatic assembly equipment. No preferred orientation.
Either flow or reflow soldering methods can be used due to electroplating of the terminal electrodes.
High reliability due to an entirely monolithic structure.
Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits.
Low DC resistance s.

📁 Similar Datasheet

MMZ25332BT1 - Heterojunction Bipolar Transistor (NXP)
MMZ25333B - InGaP HBT Linear Amplifier (NXP)
MMZ27333BT1 - High Gain Power Amplifier (NXP)
MMZ09312BT1 - Heterojunction Bipolar Transistor (Freescale Semiconductor)
MMZ09332BT1 - Heterojunction Bipolar Transistor (NXP)
MMZ38333BT1 - 3.8 GHz Linear Power Amplifier and BTS Driver (NXP)

Other Datasheets by TDK

MMZ2012xxxx - (MMZ Series) CHIP BEADFERRITE
MMZ0603 - Chip Beads
MMZ0603AFY560VT000 - EMC Components
MMZ0603D330C - Chip Beads
MMZ0603D560C - Chip Beads
MMZ0603D800C - Chip Beads

Published: Dec 18, 2005 |