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MLG0603Q0N8 - SMD Inductors

Download the MLG0603Q0N8 datasheet PDF. This datasheet also covers the MLG0603Q0N3 variant, as both devices belong to the same smd inductors family and are provided as variant models within a single manufacturer datasheet.

Features

  • It serializes a product of acquisition inductance 0.3 to15nH. In a product of 0.3 to 1.0nH, it realizes line up in a 0.1nH steppe.
  • By the most suitable design, Q is higher than competing in a conventional product MLG0603S type. In particular, Q in more than 800MHz largely improved.
  • Advanced monolithic structure is formed using a multilayering and sintering process with ceramic and conductive materials for high-frequency.
  • The products contain no lead and al.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MLG0603Q0N3_TDK.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

Part Number Description Manufacturer
MLG0402S SMD Inductors TDK Electronics
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Other Datasheets by TDK Corporation

Part Number Description
MLG0603Q0N3 SMD Inductors
MLG0603Q0N4 SMD Inductors
MLG0603Q0N5 SMD Inductors
MLG0603Q0N6 SMD Inductors
MLG0603Q0N7 SMD Inductors

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
(1/6) SMD Inductors(Coils) For High Frequency(Multilayer) MLG Series MLG0603Q Type FEATURES • It serializes a product of acquisition inductance 0.3 to15nH. In a product of 0.3 to 1.0nH, it realizes line up in a 0.1nH steppe. • By the most suitable design, Q is higher than competing in a conventional product MLG0603S type. In particular, Q in more than 800MHz largely improved. • Advanced monolithic structure is formed using a multilayering and sintering process with ceramic and conductive materials for high-frequency. • The products contain no lead and also support lead-free soldering. APPLICATIONS For high-frequency applications including mobile phones, high frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB and tuners. SHAPES AND DIMENSIONS 0.6±0.
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