Description
Value
Unit
Conditions
PD Power Dissipation (Note 1)
410 mW
VF Forward Voltage Drop
0.9
RθJA RθJL
Thermal Resistance, Junction to Ambient Air (Note 2)
Thermal Resistance, Junction to Lead
430 320
TJ, TSTG
Operating Junction and Storage Temperature Range
-55 to +150
Note:1.Mounted on 48cm2 FR-4 PCB.2.Mounted on an FR-4 PCB, with minimum recommeded pad.V °C/W
°C
IF=10mA
TAIT
Features
- Planar Die Construction.
- 410mW Power Dissipation.
- Zener Voltage 2.4v to 75v.
- Zener Voltage Tolerance: ±2%.
- Ideally Suited for Automated Assembly Processes.
- RoHS Compliance
SOD-123
Mechanical Data
Case:
SOD-123, molded plastic
Terminals:
Solderable per MIL-STD-750,Method 2026
Polarity:
See Diagram Below
Approx Weight: 0.01 grams,0.0004 ounces
Maximum Ratings (T Ambient=25ºC unless noted otherwise)
Symbol.
