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FGM230S - Proprietary SiP Module

Features

  • low-current consumption, a rich set of MCU peripherals, and ample memory, all in a 6.5 x 6.5 mm package. The FGM230S is a complete solution supported by powerful and fully-upgradeable software, advanced development and debugging tools, and documentation that will simplify and minimize the development cycle, certification process, and deployment of your endproduct, helping to accelerate its time-to-market significantly. The FGM230S is targeted for a broad range of.

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    FGM230S Proprietary SiP Module Data Sheet The FGM230S is a system-in-package (SiP) module for Proprietary wireless connectivities built for the performance, security, and energy demands of Proprietary applications. Based on the EFR32FG23 SoC, it delivers robust RF performance, long-range, industryleading security features, low-current consumption, a rich set of MCU peripherals, and ample memory, all in a 6.5 x 6.5 mm package. The FGM230S is a complete solution supported by powerful and fully-upgradeable software, advanced development and debugging tools, and documentation that will simplify and minimize the development cycle, certification process, and deployment of your endproduct, helping to accelerate its time-to-market significantly.
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