UPGT801-S Datasheet (Seoul Semiconductor)

UPGT801-S, LED

This surface-mount LED comes in PLCC standard package dimension.

It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame.

The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone The package design coupled with careful s

UPGT801-S Features

* 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Color & Binning 6. Outline Dimension 7. Packing 8. Soldering 9. Precaution for use 10. Handling of Silicone resin LEDs Rev. 00 September 2010 www.seoulsemicon.com Document No. : SSC-QP-7-07-24 (Rev.00) TZe-cPhonwie