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SKiiP1092GB170 - intelligent Power PACK halfbridge

Features

  • Low thermal impedance.
  • Optimal thermal management with integrated heatsink.
  • Pressure contact technology with increased power cycling capability, compact design.
  • Low stray inductance.
  • High power, small losses.
  • Overtemp. protection.
  • Short circuit protection.
  • Isolated power supply 1) Theatsink = 25 °C, unless otherwise specified 2) CAL = Controlled Axial Lifetime Technology (soft and fast) 3) without driver 4) Driver input to.

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Datasheet Details

Part number SKiiP1092GB170
Manufacturer Semikron International
File Size 42.71 KB
Description intelligent Power PACK halfbridge
Datasheet download datasheet SKiiP1092GB170 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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SKiiP 1092 GB 170 - 470 WT/FT Absolute Maximum Ratings Symbol Conditions 1) IGBT & Inverse Diode VCES VCC 9) Operating DC link voltage IC Theatsink = 25 °C ICM Tj 3) Visol 4) Theatsink = 25 °C; tp < 1 ms IGBT & Diode AC, 1 min. IF= – IC Theatsink = 25 °C IFM Theatsink = 25 °C; tp < 1 ms IFSM tp = 10 ms; sin.; Tj = 150 °C I2t (Diode) tp = 10 ms; Tj = 150 °C Driver VS1 VS210) dv/dt Top, Tstg Stabilized power supply Nonstabilized power supply Primary to second. side Operating / stor. temperature (version FT) Values Units 1700 1200 1000 2000 – 55 . . .+ 150 4000 830 2000 8600 374 V V A A °C V A A A kA2s 18 30 75 – 25(0) . . .
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