Description
These miniature surface mount MOSFETs utilize a high cell density trench process to provide low RDS(on) and to ensure minimal power loss and heat dissipation.
Features
- Low RDS(on) provides higher efficiency and extends battery life. Low thermal impedance copper leadframe SC-59 saves board space. Fast switching speed. High performance trench technology. SC-59
A
L
3
Top View
CB
12
KE
1
3 2
D F GH J
REF. A B C D E F
Millimeter Min. Max. 2.70 3.10 2.25 3.00 1.30 1.70 1.00 1.40
1.70 2.30
0.35 0.50
REF. G H J K L
Millimeter Min. Max. 0.10 REF. 0.40 REF. 0.10 0.20 0.45 0.55
0.85 1.15.
SMG2307PE-SeCoS.pdf
