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CIM10U121 - Chip Bead

Download the CIM10U121 datasheet PDF. This datasheet also covers the CIB variant, as both devices belong to the same chip bead family and are provided as variant models within a single manufacturer datasheet.

Description

Part no.

Features

  • Perfect shape for automatic mounting, with no directionality.
  • Excellent solderability and high heat resistance for either flow or reflow soldering.
  • Monolithic inorganic material construction for high reliability.
  • Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (CIB-10P100.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

Part Number Description Manufacturer
CIM Crystals MTRONPTI
CIM-130M7 CIM-xxxx ETC
CIM-51M7 CIM-xxxx ETC

Other Datasheets by Samsung Semiconductor

Part Number Description
CIM10U121 Chip Bead
CIM10U102 Chip Bead
CIM10U102 Chip Bead
CIM10U202 Chip Bead
CIM10U202 Chip Bead

Full PDF Text Transcription

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Chip Bead For EMI Suppression 201208 CIB/CIM10 Series (1608/ EIA 0603) APPLICATION High frequency EMI prevention application to computers, printers, VCRs, TVs and mobile phones. FEATURES  Perfect shape for automatic mounting, with no directionality.  Excellent solderability and high heat resistance for either flow or reflow soldering  Monolithic inorganic material construction for high reliability  Closed magnetic circuit configuration avoids crosstalk and is suitable for high density PCBs. DIMENSION RECOMMENDED LAND PATTERN 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm 0.6~0.8mm Type Dimension [mm] LW t d 10 1.6±0.15 0.8±0.15 0.8±0.15 0.3±0.2 DESCRIPTION Part no.
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