MR18R1624GEG0 - Key Timing Parameters

Samsung semiconductor

The MR18R1624GEG0 by Samsung semiconductor is a Key Timing Parameters. Below is the official datasheet preview.

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MR18R1624GEG0 Key Timing Parameters by Samsung semiconductor - Datasheet Preview — Official preview page of the **MR18R1624GEG0** Key Timing Parameters datasheet (Samsung semiconductor).

Datasheet Details

Part number	MR18R1624GEG0
Manufacturer	Samsung semiconductor
File Size	485.61 KB
Description	Key Timing Parameters
Datasheet	MR18R1624GEG0_Samsungsemiconductor.pdf
Additional preview pages of the MR18R1624GEG0 datasheet.

MR18R1624GEG0 Product details

Description

Signal Pins A1, A3, A5, A7, A9, A11, A13, A15, A17, A19, A21, A23, A25, A27, A29, A31, A33, A39, A52, A60, A62, A64, A66, A68, A70, A72, A74, A76, A78, A80, A82, A84, A86, A88, A90, A92, B1, B3, B5, B7, B9, B11, B13, B15, B17, B19, B21, B23, B25, B27, B29, B31, B33, B39, B52, B60, B62, B64, B66, B68, B70, B72, B74, B76, B78, B80, B82, B84, B86, B88, B90, B92 B10 B12 B34 A20, B20, A22, B22, A24 A14 A12 I I I I I I RSL RSL VCMOS RSL RSL RSL I/O Type Description Gnd www.DataSheet4U.com Ground ref

Features

High speed up to 1066 MHz RDRAM storage.
184 edge connector pads with 1mm pad spacing.
Module PCB size : 133.35mm x 31.75mm x 1.27mm Form Factor The RIMM modules are offered in 184-pad 1mm edge connector pad pitch suitable for 184 contact RIMM connectors. Figure 1 below, shows a sixteen device RIMM module. (5.25” x 1.25” x 0.05”) - 256Mb and 288Mb base PC800 RIMM Module.
Module PCB size : 133.35mm x 34.93mm x 1.27mm (5.25” x 1.375” x 0.05”) - 256Mb and 288M.

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Published: Nov 14, 2008 |