MR18R16224DF0_Samsungsemiconductor.pdf
Datasheet Details
Part number:
MR16R1624DF0, MR18R16224DF0
Manufacturer:
Samsung semiconductor
File Size:
442.47 KB
Description:
(mr1xr1622(4/8/g)df0) key timing parameters.
Note:
This datasheet PDF includes multiple part numbers: MR16R1624DF0, MR18R16224DF0.
Please refer to the document for exact specifications by model.
MR16R1624DF0, MR18R16224DF0, (MR1xR1622(4/8/G)DF0) Key Timing Parameters
Signal Pins A1, A3, A5, A7, A9, A11, A13, A15, A17, A19, A21, A23, A25, A27, A29, A31, A33, A39, A52, A60, A62, A64, A66, A68, A70, A72, A74, A76, A78, A80, A82, A84, A86, A88, A90, A92, B1, B3, B5, B7, B9, B11, B13, B15, B17, B19, B21, B23, B25, B27, B29, B31, B33, B39, B52, B60, B62, B64, B66, B68
MR16R1622(4/8/G)DF0 MR18R1622(4/8/G)DF0 Change History Version 1.0 (July 2002) First copy.
Based on the 1.4 ver.
(July 2002) 256/288Mbit A-die RIMM Module Datasheet Page 0 Version 1.0 July 2002 MR16R1622(4/8/G)DF0 MR18R1622(4/8/G)DF0 (16Mx16) 2(4/8/16)pcs RIMM Module based on 256Mb D-die, 32s banks,16K/32ms Ref, 2.5V (16Mx18) 2(4/8/16)pcs RIMM Module based on 288Mb D-die, 32s banks,16K/32ms Ref, 2.5V Overview The RIMM module is a general purpose high- performance memo
MR16R1624DF0 Features
* High speed up to 1066 MHz RDRAM storage
* 184 edge connector pads with 1mm pad spacing
* Module PCB size : 133.35mm x 31.75mm x 1.27mm (5.25” x 1.25” x 0.05”) - 256Mb and 288Mb base PC800 RIMM Module
* Module PCB size : 133.35mm x 34.93mm x 1.27mm (5.25” x 1.375” x
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