K522H1HACF-B050 2Gb (128M x16) NAND Flash + 1Gb (64M x16 ) Mobile DDR SDRAM

Samsung semiconductor

Description

Rev.1.0, Oct.2010 K522H1HACF-B050 MCP Specification 2Gb (128M x16) NAND Flash + 1Gb (64M x16 ) Mobile DDR SDRAM datasheet SAMSUNG ELECTRONICS RES.
The K522H1HACF is a Multi Chip Package Memory which combines 2G bit NAND Flash and 1G bit Mobile DDR synchronous Dynamic RAM.

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Datasheet Specifications

Part number: K522H1HACF-B050
Manufacturer: Samsung semiconductor
File Size: 1.80 MB
Datasheet: K522H1HACF-B050_Samsungsemiconductor.pdf
Description: 2Gb (128M x16) NAND Flash + 1Gb (64M x16 ) Mobile DDR SDRAM

Features

* Operating Temperature : -25°C ~ 85°C
* Package : 153ball FBGA Type - 8x9x1.0mmt, 0.5mm pitch
* Voltage Supply : 1.7V ~ 1.95V
* Organization - Memory Cell Array : (256M + 8M) x 8bit for 2Gb (512M + 16M) x 8bit for 4Gb DDP - Data Register : (2K +

Applications

* where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office.

K522H1HACF-B050 Distributors

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K522H1HACF-B050 2Gb 128M x16 NAND Flash 1Gb 64M x16 Mobile DDR SDRAM Samsung semiconductor

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