K4B1G0846C, K4B1G0446C 1Gb C-die DDR3 SDRAM

Samsung semiconductor

Description

K4B1G04(08/16)46C 1Gb DDR3 SDRAM www.DataSheet4U.com 1Gb C-die DDR3 SDRAM Specification Revision 1.0 June 2007 INFORMATION IN THIS DOCUMENT IS PRO.
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📥 Download Datasheet

K4B1G0846C Datasheet Preview — This datasheet PDF includes multiple part numbers: K4B1G0846C, K4B1G0446C. Please refer to the document for exact specifications by model.

Datasheet Specifications

Part number: K4B1G0846C, K4B1G0446C
Manufacturer: Samsung semiconductor
File Size: 1.30 MB
Datasheet: K4B1G0446C_Samsungsemiconductor.pdf
Description: 1Gb C-die DDR3 SDRAM
Note: This datasheet PDF includes multiple part numbers: K4B1G0846C, K4B1G0446C.
Please refer to the document for exact specifications by model.

Features

* 4 3.0 Package pinout/Mechanical Dimension & Addressing 5 3.1 x4 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) 5 3.2 x8 Package Pinout (Top view) : 94ball FBGA Package(78balls + 16 balls of support balls) 6 3.3 x16 Package Pinout (Top view) : 112ball FBGA Packag

Applications

* where Product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.

K4B1G0846C Distributors

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K4B1G0446C 1Gb C-die DDR3 SDRAM Samsung semiconductor

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