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KMM466F404BS2-L - 4M X 64 DRAM SODIMM

Description

The Samsung KMM466F404BS2-L is a 4Mx64bits Dynamic RAM high density memory module.

The Samsung KMM466F404BS2-L consists of four CMOS 4Mx16bits DRAMs in TSOP 400mil packages and a 2K EEPROM in 8www.DataSheet4U.com pin TSSOP package mounted on a 144-pin glass-epoxy substrate.

Features

  • Part Identification - KMM466F404BS2-L(4096 cycles/128ms, TSOP, L-ver).
  • Extended Data Out Mode Operation.
  • New JEDEC standard proposal with EEPROM.
  • Serial Presense Detect with EEPROM.
  • CAS-before-RAS Refresh capability.
  • Self -refresh capability.
  • RAS-only and Hidden refresh capability.
  • LVTTL compatible inputs and outputs.
  • Single +3.3V± 0.3V power supply.
  • PCB : Height(1000mil), double sided component.

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Other Datasheets by Samsung Semiconductor

Part Number Description
KMM466F404CS2-L 4M X 64 DRAM SODIMM
KMM466F203CS2-L 2M X 64 SODIMM
KMM466F213CS2-L 2M X 64 SODIMM
KMM466F804BS1-L 8M X 64 DRAM SODIMM
KMM466F804CS1-L 8M X 64 DRAM SODIMM

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
DRAM MODULE KMM466F404BS2-L KMM466F404BS2-L EDO Mode 4M x 64 DRAM SODIMM Using 4Mx16, 4K Refresh 3.3V, Low power/Self-Refresh GENERAL DESCRIPTION The Samsung KMM466F404BS2-L is a 4Mx64bits Dynamic RAM high density memory module. The Samsung KMM466F404BS2-L consists of four CMOS 4Mx16bits DRAMs in TSOP 400mil packages and a 2K EEPROM in 8www.DataSheet4U.com pin TSSOP package mounted on a 144-pin glass-epoxy substrate. A 0.1uF decoupling capacitor is mounted on the printed circuit board for each DRAM. The KMM466F404BS2-L is a Small Out-line Dual in-line Memory Module and is intended for mounting into 144 pin edge connector sockets.
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