SH68N65DM6AG Datasheet (STMicroelectronics)

SH68N65DM6AG, N-channel Power MOSFET

This device combines two MOSFETs in a half-bridge topology.

The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly.

Thanks to the DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad.

The

SH68N65DM6AG Features

* Order code SH68N65DM6AG VDS 650 V RDS(on) max. 41 mΩ ID 64 A

* AQG 324 qualified

* Half-bridge power module

* 650 V blocking voltage

* Fast recovery body diode

* Very low switching energies

* Low package inductance

* Dice on direct bond cop