Datasheet4U Logo Datasheet4U.com

SDIP30 Datasheet - STMicroelectronics

SDIP30 SDIP30 Thermal Data

 Thermal Data www.DataSheet4U.com SDIP 30 30 leads PACKAGE MATERIAL LIST item # leadframe die attach molding compound material copper epoxy glue ( silver filler ) epoxy resin thickness 0.25 mm 10-40 µm 3.8 mm thermal conductivity 2.61 W/cm°C 0.01 W/cm°C 0.0063W/cm°C Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time September 1999 1/2 Thermal Data Rth(j-a) (ºC/W) 75 1) 70 65 SDIP 30 www.DataSheet4U.com die size 160x80 sq. mils mounted on a low K board (1s 1 Oz.).

SDIP30 Datasheet (53.16 KB)

Preview of SDIP30 PDF
SDIP30 Datasheet Preview Page 2

Datasheet Details

Part number:

SDIP30

Manufacturer:

STMicroelectronics ↗

File Size:

53.16 KB

Description:

Sdip30 thermal data.

📁 Related Datasheet

SDI-001 SERIAL D1 TO RGB/YPBPR AND CVBS MODULE (Faraday Technology)

SDI-002 SERIAL D1 TO RGB MODULE (Faraday Technology)

SDI-003 SERIAL D1 TO CVBS/YC MODULE (Faraday Technology)

SDI-321618 SMD Miniature Inductors (Chilisin)

SDI-322520 SMD Miniature Inductors (Chilisin)

SDI-453226 SMD Miniature Inductors (Chilisin)

SDI-C403 Bi-CMOS IC (Ever)

SDI100N12 NPT IGBT Modules (Sirectifier Semiconductors)

TAGS

SDIP30 SDIP30 Thermal Data STMicroelectronics

SDIP30 Distributor