DIP40 Datasheet (STMicroelectronics)

DIP40, Thermal Data

 Thermal Data DIP 40 40 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.25 mm 10-40 µm molding compound 3.8 mm 0.0063W/cm°C Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time September 1999 1/2 Thermal Data Dip 40 Rth(j-a) (ºC/W) 65 1) 60 die size 35000 sq.

mils dissipating area 2000 sq.

mils 2 s 1 Oz.

board 55 50 0 0.5 1 1.5 dissipated