QFP-SD Stacked Die Quad Flat Pack

Description

www.DataSheet4U.com QFP-SD Stacked Die Quad Flat Pack * Stacking of die enables more functionality and integration in a conventional QFP pack.
STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD.

📥 Download Datasheet

QFP-SD Datasheet Preview — Preview of QFP-SD PDF

Datasheet Specifications

Part number: QFP-SD
Manufacturer: STATS ChipPAC
File Size: 647.87 KB
Datasheet: QFP-SD_STATSChipPAC.pdf
Description: Stacked Die Quad Flat Pack

Features

* Combining devices into one package reduces PCB real estate and cost
* Increased sub-system performance by integrating multiple chips into a single package
* Die to die bonding capability for device/signal integration
* Standard and green/lead-free materials and Pb-f

Applications

* Stacked Die QFP packages are currently available in LQFP, LQFP-ep and TQFP-ep configurations, and are offered in standard and green/lead-free bill of materials. APPLICATIONS Suitable for a variety of applications including memory integration (ASIC or Logic), chipset integration (Analog/ Digital),

QFP-SD Distributors

📁 Related Datasheet

QFP-A64 QFP-T80 QFP44 QFP56

📌 All Tags

QFP-SD Stacked Die Quad Flat Pack STATS ChipPAC

STATS ChipPAC QFP-SD-like datasheet

QFP-EP