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AM41DL32X4G Stacked Multi-Chip Package (MCP) Flash Memory/SRAM

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Description

www.DataSheet4U.com Am41DL32x4G Data Sheet July 2003 The following document specifies Spansion memory products that are now offered by both Advanced.
Am29DL32xG Features The Am29DL322G/323G/324G consists of 32 megabit, 3.

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Datasheet Specifications

Part number
AM41DL32X4G
Manufacturer
SPANSION
File Size
1.61 MB
Datasheet
AM41DL32X4G_SPANSION.pdf
Description
Stacked Multi-Chip Package (MCP) Flash Memory/SRAM

Features

* s Power supply voltage of 2.7 to 3.3 volt s High performance
* Access time as fast as 70 ns SOFTWARE FEATURES s Data Management Software (DMS)
* AMD-supplied software manages data programming and erasing, enabling EEPROM emulation
* Eases sector erase limitations s Package

Applications

* Three devices are available with the following bank sizes: Device DL322 DL323 DL324 Bank 1 4 8 16 Bank 2 28 24 16 DataShee has been completed, the device automatically returns to reading array data. The sector erase architecture allows memory sectors to be erased and reprogrammed without affectin

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