PC123XNYSZ0F Datasheet - SHARP

PC123XNYSZ0F Photocoupler

PC123XNYSZ0F Features

* 1. 4-pin DIP package 2. Double transfer mold package (Ideal for Flow Solder- ing) 3. Current transfer ratio (CTR : MIN. 50% at IF=5 mA, VCE=5V) 4. Several CTR ranks available 5. Reinforced insulation type (Isolation distance : MIN. 0.4mm) 6. Long creepage distance type (wide lead-form type only : MI

PC123XNYSZ0F Datasheet (289.31 KB)