SUF-1000 - Cascadable pHEMT MMIC Amplifier

RF Micro Devices

SUF-1000 Datasheet Preview — Preview of SUF-1000 PDF

Datasheet Details

Part number	SUF-1000
Manufacturer	RF Micro Devices
File Size	736.51 KB
Description	Cascadable pHEMT MMIC Amplifier
Datasheet	SUF-1000-RFMicroDevices.pdf

SUF-1000 Product details

Description

(Dimensions in inches [millimeters]) Notes: 1. 2. 3. 4. 5. 6. No connection required for unlabeled bond pads Die thickness is 0.004 [0.10] Typical bond pad is 0.004 [0.10] square Backside metallization: Gold Backside is ground Bond pad metallization: Gold Pin Names and Descriptions Pin Name Description 1 RFIN This pad is DC coupled and matched to 50Ω.An external DC block is required.2 RFOUT/BIAS This pad is DC coupled and matched to 50Ω.Bias is applied through this pad.Die Bottom

Features

Broadband Flat Gain = 10dB.
P1dB = 14dBm.
Direct-Coupled Topology.
Efficient Single-Supply Operation: 5V, 45mA.
Low Gain Variation versus Temperature.
Compact Die Size (0.75mm x 0.88m).
Patented Self-Bias Darlington.

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Published: Apr 1, 2016 |