.
The PZ3D6V8H is packaged in a SOD-323 surface mount package that has a power dissipation of 500mW.
PZ3D6V8H Applications
* Cellular phones
* Hand held portables
* High density PC boards
Mechanical Characteristics
* Lead finish:100% matte Sn(Tin)
* Mounting position: Any
* Qualified max reflow temperature:260℃
* Pure tin plating: 7 ~ 17 um
* Pin flatness:≤3mil
Electronics Parameter
I
I