BGW211 Datasheet - Philips

BGW211 Low Power WLAN SiP

Low-power 802.11g SiP Size 10 x 15 x 1.3 mm Part number BGW211 Philips Semiconductors Philips Semiconductors is a .

BGW211 Low-power WLAN SiP Optimized for use in battery-powered handheld devices, the BGW211 System-in-a-Package (SiP) delivers complete 802.11g functionality with the industry’s lowest standby and operating power consumption. It requires no external components and uses only 150 mm2 of board area for the total 802.11g solution. Complete, single-package 802.11g solution for mobile phones and portable consumer devices Semiconductors The BGW211 is Philips’ third-generation System-in-a-Package (SiP.

BGW211 Features

* Advanced, single-package WLAN 802.11g optimized for mobile handheld devices

* No RF-critical design required

* Low total cost of ownership

* Lowest-power consumption in standby (< 2 mW) and operating modes (PA, RF, baseband/MAC)

* Ultra-small form factor

BGW211 Datasheet (163.08 KB)