Datasheet Details
| Part number | AN80T05 |
|---|---|
| Manufacturer | Panasonic |
| File Size | 0.96 MB |
| Description | Silicon Monolithic Bipolar IC |
| Datasheet |
 AN80T05-Panasonic.pdf
|
| Part number | AN80T05 |
|---|---|
| Manufacturer | Panasonic |
| File Size | 0.96 MB |
| Description | Silicon Monolithic Bipolar IC |
| Datasheet |
AN80T05-Panasonic.pdf
|
Chip surface passivation Lead frame material Inner lead surface process Others ( Others ( Others ( ) ) ) ) 1 2 , 6 2 6 3 4 4 5 5 7 3 3 Outer lead surface process Chip mounting method Wire bonding method Wire material Mold material Molding method Fin material Solder plating (98Sn-2Bi), Solder dip, Others ( Ag paste, Au-Si alloy, Solder (95.5Pb-2.5Ag-2Sn) Others ( Others ( Others ( Others ( Others ( ) ) ) ) ) Thermalsonic bonding, Au, Epoxy, Transfer mold, Multiplunger m
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