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NXH50C120L2C2ESG - TMPIM 50A CIB/CI Module

ON Semiconductor

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Datasheet Details

Part number	NXH50C120L2C2ESG
Manufacturer	ON Semiconductor
File Size	416.41 KB
Description	TMPIM 50A CIB/CI Module
Datasheet	NXH50C120L2C2ESG-ONSemiconductor.pdf

NXH50C120L2C2ESG Product details

Features

Low Thermal Resistance Substrate for Low Thermal Resistance.
Lower Package Height than Standard Case Modules.
6 mm Clearance distance between pin to heatsink.
Compact 73 mm × 40 mm × 8 mm Package.
Solderable Pins.
Thermistor.
These Devices are Pb.
Free, Halogen Free/BFR Free and are RoHS Compliant Typical.

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Published: Apr 1, 2020 |