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BCW69LT1 General Purpose Transistors

BCW69LT1 Description

BCW69LT1 General Purpose Transistors PNP Silicon MAXIMUM RATINGS Rating Collector *Emitter Voltage Emitter *Base Voltage Collector Cur.

BCW69LT1 Features

* l stress to which the devices are subjected.
* Always preheat the device.
* The delta temperature between the preheat and soldering should be 100°C or less.
* When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature

BCW69LT1 Applications

* Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to

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