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OSD32MP157 - Microprocessor

Description

17 5.2 Reserved Balls 22 5.3 Test Point Signals 22 6 OSD32MP15x Components 23 6.1 STM32MP15x Processor 24 6.1.1 I/O Voltages 24 6.2 DDR3L Memory 24 6.3 MEMS Oscillators 25 6.3.1 HSE MEMS Oscillator 25 6.4 EEPROM 26 6.4.1 EEPROM Contents 26 6.4.2 EEPROM Write Protection 26 7 Power Management

Features

  • ST STM32MP15x, DDR3L, STPMIC1A, 4KB EEPROM, Oscillator and passive components integrated into a single package.
  • STM32MP15x Features: o Arm® Cortex®-A7 up to 800MHz x2 o Arm® Cortex®-M4 up to 209MHz o NEON™SIMD Coprocessor x2 o Arm® TrustZone® o USB 2.0 HS + PHY x2 o Ethernet 10/100/1000 o CAN FD/TTCAN x2, UART x4, USART x4, SPI x6, I2C x6, I2S x3, QSPI x2 o eMMC/SD/SDIO Ports x3 o GPIO x148 o 24-bit RGB Display, MIPI DSI o Camera Interface o 22 Channel 16-bit ADC x2, 12-bit DA.

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Datasheet Details

Part number OSD32MP157
Manufacturer OCTAVO
File Size 1.58 MB
Description Microprocessor
Datasheet download datasheet OSD32MP157 Datasheet
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Full PDF Text Transcription

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OSD32MP15x Datasheet Rev. 7 11/30/2022 Introduction The OSD32MP15x System-in-Package (SiP) devices deliver all the power of a Microprocessor in a package that feels like a Microcontroller in the smallest possible footprint. At their core, the OSD32MP15x devices have the versatile STMicroelectronics STM32MP15x featuring Dual Arm® Cortex® A7 Cores and an Arm® Cortex® M4. Along with the processor, the OSD32MP15x integrates up to 1GB of DDR3L, STPMIC1 Power Management IC, EEPROM, MEMs Oscillator, and passives into a single easy to use BGA package. This integration enables fastest designs with the STM32MP15x by removing the tedious tasks that do not add value to an end system while allowing low costmanufacturing and miniaturized products.
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