Ceramics () Hard Glass (with phosphor) Encapsulating Resin Materials Silicone Resin Electrodes Materials Weight Au-plated 0.011g(TYP) * 。 Dimensions do not include mold flash. Protection Device 4 SOLDERING * Reflow Soldering Condition(Lead-free Solder) 1 to 5°C per sec Pre.
NICHIA STS-DA1-3008C NICHIA CORPORATION SPECIFICATIONS FOR WHITE LED NC2W170BT Pb-free Reflow Soldering Application Built-in ESD Protection Device RoHS Compliant ISO/TS16949 Compliant SPECIFICATIONS NICHIA STS-DA1-3008C (1) Absolute Maximum Ratings Item Symbol Absolute Maximum Rating Forward Current IF 1200 Pulse Forward Current IFP 1500 Allowable Reverse Current IR 85 Power Dissipation PD 8.88 Operating Temperature Topr.